Advanced Lead – SiC/GaN Power Module Packaging Engineer job opportunity at GE Aerospace.

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GE Aerospace Advanced Lead – SiC/GaN Power Module Packaging Engineer
Experience: 3-years
Pattern: full-time
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Administration

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degreeMaster's (M.Eng.)
United States Of America

#Power #Module #Design and #Simulation Collaborate with power module design team, provide insight on the developed module performance using simulation tools. Collaborate with design and R&D teams to ensure manufacturability and scalability of new GaN and SiC power module designs. __ Process #Development: Develop and optimize manufacturing processes for GaN and SiC power modules, including die attach, wire bonding, encapsulation, and testing. __ Process Optimization: Identify and implement process improvements to enhance yield, efficiency, and reliability of GaN and SiC power module production. Utilize statistical process control (SPC) and other quality tools to monitor and improve process performance. __ Quality Control: Develop and implement quality control procedures to ensure compliance with industry standards and customer requirements. Conduct root cause analysis and implement corrective actions to address process-related quality issues. __ Documentation and Reporting: Guide the team to maintain detailed process documentation, including process flow diagrams, work instructions, and standard operating procedures (SOPs). Prepare technical reports and presentations to communicate process development and improvement activities. __ Training and Support: Train production staff on new processes and equipment. Provide technical support to production teams to resolve process-related issues. __ Safety and Compliance: Ensure all manufacturing processes comply with safety regulations and company policies. Participate in regular safety audits and risk assessments to identify and mitigate potential hazards.
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