Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging) job opportunity at BOSCH.

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BOSCH Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging)
Experience: 3-years
Pattern: full-time
Country:
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Salary:
Status:

Architect

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degreeMaster's (M.Sc.)
Philippines

We are seeking a development engineer for MEMS assembly and interconnect technologies who likes to cooperate closely with our partners. You will work with industry-leading OSATs, machine and material suppliers to develop packaging processes that enable the realization of a large variety of MEMS devices. Working on-site at one of the largest assembly partners closely cooperating with the local teams of our supplier. Part of a team of packaging experts within Bosch and our suppliers to develop and characterize new and innovative optical MEMS device packages. Part of an interdisciplinary product development team with customer representatives, purchasing, MEMS design and technology, reliability, testing, simulation, construction, production, and quality team members. Responsible for the material and machine selection and associated process development for core assembly steps. __ Selecting and qualifying new suppliers (assembly subcons, equipment and raw material suppliers). Co-working with equipment suppliers to enhance existing or to develop new machines. __ Take care of the development, qualification, and transfer to mass production of new assembly processes and materials. Owner of specifications and technical documentation concerning the optical MEMS package, assembly process, and raw materials. __ #Jobs #Hiring #Associate

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