Packaging Customer Engineer position at Intel.| United States Of America

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Intel Packaging Customer Engineer

Experience: 9-years

Pattern: full-time

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US, Arizona, P..........United States Of America

Job Details: Job Description: Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.The IFS Packaging and Test Business GroupPackaging is a critical revenue enabler for IFS and a key part of Intel's forward-looking strategy. IFS Packaging Test Business Group has been created to develop, grow, and execute a robust packaging roadmap.The primary responsibilities for the Packaging Customer Engineer will include but are not limited to: Collaborate with IFS Customer product design, internal product design, Silicon process development, Intel's Assembly Test Technology Development (ATTD), and Product Engineering teams to drive product architecture definition, product package design and execution.Serve as the engineering interface to IFS Customers for packaging services to promote Intel packaging technologies, to perform technical feasibility and risk assessments, to analyze product ask vs. the ATTD packaging roadmap and to close the deal with the customer.Drive Customer-facing technology reviews as the key engineering interface between the Customer and Intel Foundry, owning the Customer packaging engineering relationship from product concept through product mass production.Work with IFS Business Development, ATTD, ATM and Supply Chain to complete RFQ risk assessments and pricing assessments.Capture customer feedback and competitive trends that can better inform the ATTD packaging roadmap.Represent the customer in internal technology working groups for new technologies during pathfinding and development.This position deals with a high level of both technology and market/business ambiguity and future uncertainties. In addition, this person will be frequently interacting and making recommendations to Intel VPs and Corporate VPs and will need to be conversant and knowledgeable in both internal roadmaps and external industry trends.In this role you will need the following attributes:Strong problem solving, analytical, and communication skills.Have demonstrated the ability to plan and manage projects.Extensive knowledge of Intel packaging development and manufacturing capabilities.Experience in ATTD and Competitor packaging roadmaps.Experience with product architecture floor plans, IP development cycles, and their dependency on package design and architecture.Be able to work independently in a highly matrixed structure with extensive experience presenting to Senior Management (VP and Corporate VP Level). Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Job posting details (such as work model, location, or time type) are subject to change. Minimum Qualifications Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related STEM field. 9+ years of experience in semiconductor packaging Hands-on experience in one or more of the following areas: Power delivery High‑speed signaling Thermal‑mechanical analysis Process development Die disaggregation architectures Experience presenting technical information to external customers and suppliers. Preferred Qualifications Master’s or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or a related STEM discipline. Strong knowledge of Intel packaging technologies. Interview Tips here. By applying to this posting your resume and profile will become visible to Intel Recruiters and will allow them to consider you for current and future job openings aligned with the skills and positions mentioned above. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Intel Benefits: https://www.intel.com/content/www/us/en/jobs/benefits.html Life Inside Intel: https://www.intel.com/content/www/us/en/jobs/life-at-intel.html Interviewing Tips: https://www.intel.com/content/www/us/en/jobs/hiring.html Intel’s core values: https://www.intel.com/content/www/us/en/corporate-responsibility/our-values.html?wapkw=our%20company #LTDEngineering Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, California, Santa Clara Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $190,610.00-269,100.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Packaging Customer Engineer job opportunity at Intel.

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