Lead Hardware Engineer - Digital Design, Industrialization position at GE Vernova.| United States Of America

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GE Vernova Lead Hardware Engineer - Digital Design, Industrialization

Experience: 10-years

Pattern: full-time

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Rochester....United States Of America

Job Description Summary As a Lead Hardware Engineer for Critical Infrastructure Communications (CIC) at GE Grid Solutions, you will be responsible for leading the design of industrial grade wired and wireless communications products. CIC is seeking an experienced Electrical Engineer who is team-oriented, can thrive in the critical path, and has a demonstrated track record of bringing a broad range of products from concept to production. A successful candidate will have practical circuit-level design and troubleshooting experience in a laboratory environment. The ideal candidate should have working knowledge at the product level, as the candidate will be responsible for various aspects of the design throughout the product lifecycle including production. The successful candidate must also be capable of working collaboratively with peers in an international engineering organization to ensure design goals are met and critical trade-offs are identified. This role requires strong written and verbal communication skills to accurately convey complex solutions to audiences of varying technical expertise on a cross-functional team spanning multiple sites. About us:Grid Solutions, a GE Vernova business, serves customers globally with over 12,000 employees. We are focused on bringing together technologies and expertise to help solve the toughest power system challenges, accelerating the global transition to a more resilient and reliable grid. For more about GE’s Grid Solutions, visit https://www.gevernova.com/grid-solutions/. Job Description Roles and Responsibilities: Contribute to the hardware development of industrial-grade communications equipment by applying principles and techniques of electrical engineering, circuit design, and analysis. Complete the analysis and design of digital and mixed-signal communications circuitry including MCU, CPU, flash, Ethernet, and USB considering EMC, thermal, mechanical, and electrical safety constraints. Complete schematic and PCB layouts containing digital, analog, and RF circuitry. Create new components and maintain component database. Create production documentation including top level bills of material and label specifications. Perform sustaining engineer activities for legacy products by mitigating component shortages through qualifying alternatives or redesigning circuits and sub-assemblies to address obsolescence. Distill product requirements into technical requirements, estimate scope of work, and develop hardware concept designs as required to meet project deadlines. Work onsite with a team of Electrical and Embedded Firmware Engineers in an office/lab environment. Perform and document the results of circuit level validation testing. Ensure compliance to product safety, emissions, and performance standards supporting 3rd party certification labs as needed. Support and troubleshoot existing product design deficiencies reported by customers and manufacturing. Perform MTBF and reliability data for the individual product subsystems. Provide support and specifications to Manufacturing and Test Engineering teams. Required Qualifications: Bachelor’s degree in Engineering with 8-10 years of prior hardware design experience and product development ideally in telecommunication products. Minimum of 8 years of experience with hardware design. Familiarity with emissions standards including FCC, IC, ETSI, Anatel, or ACMA. Desired Characteristics: Experience with communication interfaces and protocols (ex. Ethernet, USB, I2C, SPI, etc). Familiarity with safety standards including EN62368-1 and EN6095-1. Proven knowledge of EMC and environmental standards required for CE Mark certification of telecommunication products. Ability to multi-task, prioritize tasks, and quickly adapt in a fast-paced engineering environment. Experience with Altium Designer. Ability to solder/desolder surface mount and through hole components using a soldering station and heat gun. Experience using signal generators, network analyzers, and spectrum analyzers. Ability to work collaboratively with an international development team. Experience with MCU, SoC, and modem Integration for 4G LTE, 5G, and WiFi technologies. Demonstrated ability to work autonomously and collaborate with a team to resolve technical issues. Demonstrated ability to produce Hardware Design Specifications and other relevant design documentation. Strong interpersonal and leadership skills. GE Vernova offers a great work environment, professional development, challenging careers, and competitive compensation. GE Vernova is an Equal Opportunity Employer . Employment decisions are made without regard to race, color, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, protected veteran status or other characteristics protected by law. GE Vernova will only employ those who are legally authorized to work in the United States for this opening. Any offer of employment is conditioned upon the successful completion of a drug screen (as applicable). Relocation Assistance Provided: Yes For candidates applying to a U.S. based position, the pay range for this position is between $89,300.00 and $148,700.00. The Company pays a geographic differential of 110%, 120% or 130% of salary in certain areas. The specific pay offered may be influenced by a variety of factors, including the candidate’s experience, education, and skill set. Bonus eligibility: ineligible. This posting is expected to remain open for at least seven days after it was posted on January 28, 2026. Available benefits include medical, dental, vision, and prescription drug coverage; access to Health Coach from GE Vernova, a 24/7 nurse-based resource; and access to the Employee Assistance Program, providing 24/7 confidential assessment, counseling and referral services. Retirement benefits include the GE Vernova Retirement Savings Plan, a tax-advantaged 401(k) savings opportunity with company matching contributions and company retirement contributions, as well as access to Fidelity resources and financial planning consultants. Other benefits include tuition assistance, adoption assistance, paid parental leave, disability benefits, life insurance, 12 paid holidays, and permissive time off. GE Vernova Inc. or its affiliates (collectively or individually, “GE Vernova”) sponsor certain employee benefit plans or programs GE Vernova reserves the right to terminate, amend, suspend, replace, or modify its benefit plans and programs at any time and for any reason, in its sole discretion. No individual has a vested right to any benefit under a GE Vernova welfare benefit plan or program. This document does not create a contract of employment with any individual.

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Lead Hardware Engineer - Digital Design, Industrialization job opportunity at GE Vernova.

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