Ingénieur en Procédés d'Assemblage Photonique / Photonics Assembly Process Engineer position at Ciena Corporation.| Canada

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Ciena Corporation Ingénieur en Procédés d'Assemblage Photonique / Photonics Assembly Process Engineer

Experience: 5-years

Pattern: full-time

Country:

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Quebec....Canada

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact. Description de Poste: Nous recherchons un ingénieur en procédés d'assemblage photonique hautement motivé et rigoureux pour rejoindre notre équipe de composants photoniques, spécialisée dans les procédés de fabrication avancés pour les applications de télécommunications. Vous jouerez un rôle clé dans le développement des procédés d'assemblage de composants et systèmes photoniques, tels que les émetteurs-récepteurs optiques et autres dispositifs critiques permettant les réseaux de communication à haute vitesse. Vous collaborerez avec des équipes multidisciplinaires pour garantir la scalabilité, la fiabilité et la performance des produits photoniques utilisés dans les systèmes de télécommunications de pointe. Responsabilités principales: Concevoir, mettre en œuvre et optimiser les procédés d'assemblage, de la phase de recherche et développement (R&D) jusqu’à l’introduction en production, notamment : Les procédés au niveau des wafers (bumping, flip chip, amincissement et découpe). Le flip chip pour des interconnexions haute performance. La liaison par fils pour assurer des connexions électriques fiables. L’alignement actif permettant d’atteindre des performances optiques idéales. L’attache des puces pour un placement sécuritaire des composants photoniques. Collaborer étroitement avec les ingénieurs en conception, les techniciens de laboratoire, les partenaires de la chaîne d’approvisionnement et les fabricants sous contrat afin d’assurer une intégration fluide des nouveaux procédés. Participer à la sélection, la qualification et la mise en service des équipements d'assemblage afin de développer la capacité de production et d’assurer la scalabilité des procédés. Rédiger et maintenir la documentation des procédés, incluant les instructions d’assemblage, les diagrammes de process flow et les documents de contrôle statistique des procédés (SPC). Réaliser des analyses de défaillance et des enquêtes sur les causes fondamentales des défauts liés aux procédés, tout en mettant en œuvre des actions correctives pour améliorer la qualité des produits. Qualifications: Baccalauréat en génie mécanique, génie physique, science des matériaux, ou dans un domaine connexe. Une maîtrise ou un doctorat est un atout, mais pas obligatoire. Entre 0 et 5 ans d’expérience dans un milieu industriel ou de recherche connexe. Une expérience pratique des procédés d'assemblage photonique, des systèmes optiques ou des semi-conducteurs est fortement souhaitée. Excellentes compétences analytiques et en résolution de problèmes, avec un grand souci du détail. Solides aptitudes en communication et en collaboration, avec la capacité de travailler dans un environnement multidisciplinaire. Disponibilité pour voyager à l’occasion (visites chez les fournisseurs, installation d’équipements et collaborations avec les fabricants sous contrat). Passion pour l'innovation et l'apprentissage de nouvelles technologies. Job Description Photonics Assembly Process Engineer Position Overview: We are seeking a highly motivated and detail-oriented Photonics Assembly Process Engineer to join our photonics component team, specializing on advanced manufacturing processes for telecommunications applications. You will play a key role in the development of assembly processes for photonic components and systems, such as optical transceivers and other critical devices that enable high-speed communication networks. You will collaborate with cross-functional teams to ensure the scalability, reliability, and performance of photonic products used in cutting-edge telecommunication systems. Key Responsibilities: Design, implement, and optimize assembly processes from the R&D phase through production introduction, including: Wafer-level processes (e.g., wafer bumping, bonding, thinning and singulation). Flip chip bonding for high-performance interconnects. Wire bonding for reliable electrical connections. Active alignment to achieve precise optical performance. Die bonding for secure placement and integration of photonic components. Work closely with design engineers, laboratory technologists, supply chain partners and contract manufacturers to ensure seamless integration of new processes. Support the selection, qualification, and commissioning of assembly equipment to develop production capacity and ensure process scalability. Develop and maintain process documentation, including assembly plan, process flow diagrams, and statistical process control (SPC) documentation. Perform failure analysis and root cause investigations for process-related defects, implementing corrective actions to improve product quality. Qualifications: Bachelor’s degree in Mechanical Engineering, Materials Science, Engineering Physics, or a relevant field. A Master’s degree or PhD is a plus but not required. 0–5 years of experience in a related industrial or research environment. Hands-on experience with photonics assembly processes, optical systems, or semiconductor packaging is highly desirable. Strong analytical and problem-solving skills with attention to details. Excellent communication and teamwork skills, with the ability to work in a cross-functional environment. Willingness to travel occasionally to support supplier visits, equipment installation and collaboration with contract manufacturers. Passion for innovation and learning new technologies. Pay Range: The salary range for this role in Quebec City is $55, 700 - $88, 900 Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available. Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence. Not ready to apply? Join our Talent Community to get relevant job alerts straight to your inbox. At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination. Ciena is an Equal Opportunity Employer, including disability and protected veteran status. If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.

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Ingénieur en Procédés d'Assemblage Photonique / Photonics Assembly Process Engineer job opportunity at Ciena Corporation.

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