Package Design Engineer job opportunity at Celestial AI.



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Celestial AI Package Design Engineer
Experience: 5-years
Pattern: full-time
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Salary:
Status:

Design Engineer

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degreeBachelor's (B.Sc.)
loacation Santa Clara California, United States Of America
loacation Santa Clara Ca..........United States Of America

Package Design: Lead Si/package/PCB/system co-design work collaborating with downstream system #design #teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Celestial AI #products. __ Scope all aspects of package design feasibility at #Silicon interposer and substrate level for multi-chip SiP packaging. __ Package Layout Expertise: Lead all aspects of package layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, #mechanical, manufacturability, bumping, substrate, #material selection, assembly, and support for testing. __ Meet specifications for high-speed interfaces such as HBM, DDR, PCIe and 56G/112G SerDes. __ 2.5D and 3D Package Design Planning and Execution: Plan and #execute Silicon interposer and RDL based design layout solutions for advanced packaging #architectures. __ Netlist management for heterogeneous chiplet assemblies using latest EDA solutions. __ Substrate Manufacturing and OSAT Assembly Engagement: Supporting activities related to production and assembly of IC packages with substrate suppliers and OSATs. __ Work with cross-functional #teams and support package integration and architecture efforts with #vendors. __ Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, driving appropriate test vehicle definition and design. __ Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI

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